The **ATS-11F-154-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications The model number provides specific details regarding its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.97 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Fine Pitch (maximizes surface area) | --- ### 2. Physical Design Features * **Heat Sink Base:** A flat aluminum base designed for direct contact with the electronic component (often used with a Thermal Interface Material or TIM). * **Fin Pattern:** This model utilizes a high-density fin structure to increase the surface area available for convective cooling. * **Attachment Mechanism:** It uses a push-pin system with a compression spring. This ensures consistent pressure across the component, improving thermal transfer and preventing the heat sink from shifting during vibration. --- ### 3. Thermal Performance Profile Thermal performance is measured in terms of **°C/W** (degrees Celsius per Watt), indicating how much the temperature rises per watt of power dissipated. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (Unducted)** | 4.97 | 2.85 | 2.27 | 1.97 | 1.76 | | **Resistance (Ducted)** | 2.82 | 2.08 | 1.76 | 1.57 | 1.44 | --- ### 4. Hardware and Compatibility This part is typically supplied with the following hardware: * **Springs:** ATS-PPS-11 (Brass or Stainless Steel). * **Pins:** Plastic or Brass (depending on specific sub-configuration). * **Thermal Interface Material:** Often comes pre-applied with **SAINT-GOBAIN C700** or similar high-performance phase-change material to reduce thermal resistance between the chip and the sink.