The **ATS-11F-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | 12.30 °C/W (at 100 LFM) to 3.91 °C/W (at 700 LFM) | | **Interface Material** | T412 (Phase Change material) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated PCB "keep-out" zone. | Dimension | Value (mm) | |:---|:---| | **Width (X)** | 25.00 mm | | **Length (Y)** | 25.00 mm | | **Height (Z)** | 15.00 mm | | **Pin Pitch (X)** | 30.00 mm | | **Pin Pitch (Y)** | 30.00 mm | --- ### 3. Key Electronic/Mechanical Features * **Fine Pitch Fin Design:** The "F" in the part number indicates a **Fine-Pitch** fin pattern. This increases the surface area for heat dissipation, making it highly effective in systems with high-velocity airflow. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this uses a spring-loaded push-pin system. This ensures **consistent pressure** across the component surface, which is vital for optimal thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** The unit comes with **T412** thermal grease/pad already applied to the base, reducing assembly time and ensuring a reliable thermal bond. * **Reliability:** The use of aluminum 6063 provides a balance between thermal conductivity and structural integrity. The blue anodized finish prevents corrosion and improves emissivity. --- ### 4. Application Use-Cases This specific heat sink is typically used for: 1. **High-density PCBs:** Where space is limited (25x25mm footprint). 2. **Network Switches/Routers:** Cooling small ASICs or FPGAs. 3. **Industrial Power Supplies:** Cooling voltage regulators. 4. **Embedded Systems:** Ensuring long-term reliability of processors in enclosed environments.