The **ATS-11F-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 10mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 13.52 °C/W (at 100 LFM) | --- ### 2. Key Design Features #### A. Fin Pattern The "F" in the part number indicates a **Fine-Pitch** fin design. This provides a larger surface area relative to its footprint, making it ideal for high-density electronic assemblies where airflow might be slightly restricted but needs maximum heat dissipation. #### B. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this uses a mechanical attachment system: * **Compression Springs:** Ensure consistent pressure across the interface for optimal thermal transfer. * **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The **C2** designation typically indicates that the heat sink comes pre-applied with a high-performance thermal interface material (like T766), ensuring there are no air gaps between the component and the sink. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 13.52 | | 300 | 3.65 | | 500 | 2.15 | | 700 | 1.63 | --- ### 4. Typical Applications * **Networking:** Switches and routers where space is limited. * **Computing:** Secondary processors or chipset cooling. * **Power Electronics:** Dissipating heat from voltage regulators.