The **ATS-11F-181-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs in space-constrained environments. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Design Features #### A. Fin Pattern: Cross-Cut The "F" in the part number indicates a **Fine-Pitch** or **Cross-Cut** fin design. This pattern increases the surface area for heat dissipation and allows for omnidirectional airflow, meaning it performs well regardless of which direction the air is blowing across the PCB. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this unit uses a mechanical mounting system: * **Plastic/Brass Pins:** These lock into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the chip, maximizing heat transfer. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal grease or a similar high-performance phase-change material, ensuring low thermal resistance right out of the box. --- ### 3. Applications This specific heat sink is used in hardware where height is a limitation (low profile) but surface area is required: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Ensuring stability in high-temperature environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 11 - F - 181 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (C2 = ATS-PPS-02) | | | +------------- Height/Variant Identifier | | +------------------ Fin Style (F = Fine pitch) | +----------------------- Series Number +----------------------------- Advanced Thermal Solutions ```