The **ATS-11F-184-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, or high-power semiconductors in compact or constrained environments. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | XC (Fine Pitch / Cross-Cut) | | **Thermal Resistance** | ~2.10°C/W (at 200 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System The "R0" suffix often refers to the specific attachment kit. This system uses a spring-loaded push-pin mechanism. * **Benefits:** Provides consistent pressure for optimal heat transfer and prevents damage to the PCB. * **Hardware:** Usually consists of brass or plastic pins and stainless steel springs. #### B. Heat Sink Design (XC Fin) The "XC" designation indicates a **cross-cut** fin pattern. * Unlike straight fins, cross-cut fins allow for multi-directional airflow. * This is critical in densely packed electronic enclosures where the direction of air from cooling fans might be unpredictable. #### C. Thermal Interface Material (TIM) The base of the heat sink comes with **T766** pre-applied. * This eliminates the need for manual thermal paste application. * It ensures a thin, uniform layer between the component (die) and the aluminum base to minimize thermal impedance. --- ### 3. Application Use Cases This specific part is commonly found in: 1. **Networking Equipment:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling for MOSFET arrays or Voltage Regulator Modules (VRMs). --- ### 4. Thermal Performance Comparison *Values are approximate based on airflow (LFM - Linear Feet per Minute).* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.85 | | 200 (1.0 m/s) | 2.10 | | 400 (2.0 m/s) | 1.60 |