The **ATS-11F-186-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "push-pin" series designed for cooling semiconductors and Integrated Circuits (ICs). --- ### 1. Technical Specifications The following table outlines the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | ~1.19°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Omni-directional (High Flow) | --- ### 2. Core Electronic Components & Design The "parts" of this assembly work together to manage the thermal load of electronic devices: * **Heat Sink Body:** The 45mm square aluminum block features a high-density fin structure. It is designed to maximize surface area to dissipate heat generated by chips (CPUs, GPUs, FPGAs) into the surrounding air. * **Push-Pin Fasteners:** Unlike adhesive-based heat sinks, this uses mechanical push-pins. These provide a constant, reliable pressure (clamping force) against the electronic component, ensuring better thermal contact. * **Compression Springs:** Built into the push-pins, these springs compensate for thermal expansion and mechanical shock, preventing the heat sink from cracking the delicate silicon die. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **Phase Change Material** or thermal pad on the base to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the "parts" of the model name helps identify its specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **11F** | Series/Geometry (Profile type) | | **186** | Internal dimension/Fin density code | | **C2** | Thermal Performance Grade / Material coating | | **R0** | RoHS Compliance / Revision Status | --- ### 4. Application Use Case This part is typically found in: * **Telecommunications:** Cooling high-speed network switches. * **Computing:** Secondary cooling for chipsets or power regulators. * **Industrial:** Thermal management for motor controllers and embedded systems.