The **ATS-11F-206-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Fin Type** | Fine Pitch (XC Cut) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 50.00 mm x 50.00 mm x 10.00 mm | | **Thermal Resistance (Unducted)** | 9.40 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.45 °C/W @ 100 LFM | | **Weight** | ~45.00 grams | --- ### 2. Key Component Features #### A. XC Cut (Fine Pitch) Geometry The "XC" designation refers to the fin geometry. This design features cross-cut fins that provide a large surface area in a low-profile (10mm) package. It is optimized for multi-directional airflow, making it effective even if the air isn't blowing directly straight through the fins. #### B. pushPIN™ Attachment System Instead of using messy adhesives or fragile clips, this part uses a **push-pin and brass spring** mechanism. * **Reliability:** Provides consistent pressure (Pre-assembled with a 20-gram load) to ensure optimal thermal interface contact. * **Ease of Installation:** Fastens directly into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the unit comes with a pre-applied high-performance thermal interface material (typically **T766**), ensuring a low thermal resistance path between the heat source and the aluminum fins. --- ### 3. Part Number Breakdown To better understand the specific variant, here is how the SKU is structured: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **11**: Series (pushPIN™). * **F**: Fin Style (Fine Pitch). * **206**: Specific physical dimensions and hole patterns. * **C2**: Material/Finish (Aluminum / Blue Anodized). * **R0**: Version/TIM (Typically pre-applied thermal pad). --- ### 4. Application Use Cases * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Low-profile cooling for industrial PC boards. * **Consumer Electronics:** Use in gaming consoles or compact media servers where vertical space is limited to 10mm. ---