The **ATS-11F-207-C2-R0** is a high-performance electronic component belonging to the **Heat Sink** category, specifically designed for thermal management in integrated circuits (ICs) and surface-mount devices (SMDs). It is manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. Technical Specifications This part is part of the "pushPIN™" family, known for its tool-free installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-11F-207-C2-R0 | | **Heat Sink Type** | Push-pin Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.39 °C/W (at 100 LFM) | | **Weight** | ~40-60 grams (Varies by density) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB clearance and ensuring no interference with surrounding components like capacitors or RAM. * **Length (A):** 60.00 mm * **Width (B):** 60.00 mm * **Height (C):** 12.00 mm (Low profile) * **Pitch (E):** 53.00 mm (Distance between mounting holes) * **Pitch (F):** 53.00 mm --- ### 3. Thermal Performance Profile Thermal resistance measures the component's ability to dissipate heat. Lower values indicate better cooling. | Airflow Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.39 | | 200 | 1.0 | 4.48 | | 300 | 1.5 | 3.70 | | 400 | 2.0 | 3.24 | | 500 | 2.5 | 2.92 | --- ### 4. Key Electronic & Mechanical Features * **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism. This provides consistent pressure (clamping force) on the high-heat component, improving the efficiency of the thermal interface material (TIM). * **XC (Extra Coarse) Fin Design:** The "F" in the part number often denotes a specific fin pattern designed for optimized airflow in high-density electronic enclosures. * **Material Choice:** The use of **Aluminum 6063** provides a balance between high thermal conductivity and lightweight properties, preventing PCB warping. * **Pre-Applied TIM:** These parts usually come with a pre-applied high-performance Thermal Interface Material (Phase Change Material) to ensure immediate out-of-the-box installation. --- ### 5. Common Applications * **Networking Hardware:** Switches and routers. * **Computing:** CPU/GPU cooling in embedded systems. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Industrial Controls:** High-temperature sensors or control boards.