The **ATS-11F-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The part number encodes specific dimensions and characteristics. Below is a detailed breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.50 °C/W (at 100 LFM) | | **Base Dimensions** | 54.00 mm x 54.00 mm | | **Height** | 15.00 mm | | **Pitch (Hole spacing)** | 47.00 mm | --- ## 2. Key Components & Design Features ### A. Fin Profile (XC-Cut) This model features an **XC-Cut** pattern. Unlike standard straight fins, these are cross-cut into a "pin-fin" style grid. This design: * Increases surface area for heat dissipation. * Supports **omni-directional airflow**, meaning it can be cooled by air coming from any side of the component. ### B. pushPIN™ Attachment Mechanism The "208" and "C2" segments of the part number refer to the mounting hardware: * **Push Pins:** Uses flexible, spring-loaded pins that snap into pre-drilled holes on the PCB. * **Springs:** Provides consistent pressure (clamping force) on the electronic chip to ensure optimal thermal contact. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates the inclusion of a pre-applied thermal pad or grease. Usually, this model comes with **T766** high-performance thermal interface material to bridge the microscopic air gaps between the heat sink and the electronic component. --- ## 3. Performance Data The effectiveness of the ATS-11F-208-C2-R0 depends heavily on the velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 10.50 | | **200** | 6.27 | | **400** | 3.47 | | **600** | 2.52 | --- ## 4. Common Applications * **Networking Gear:** Switches and Routers. * **Industrial PCs:** Compact motherboards where space is limited. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.