The **ATS-11F-24-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications Below is a breakdown of the core technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 5.39°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Color/Finish** | Blue Anodized | --- ### 2. Physical Design Features The "C2" and "R0" suffixes in the part number refer to specific design and material choices: * **Cross-Cut Fin Pattern:** The heat sink uses a grid-like fin structure. This increases surface area and allows for multi-directional airflow, making it more efficient than straight-fin designs in tight enclosures. * **Push-Pin Attachment:** Instead of using messy thermal adhesives or complex screws, this part uses pre-assembled brass push-pins with a compression spring. This ensures consistent pressure on the component for optimal heat transfer. * **Thermal Interface Material (TIM):** This part typically comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact variant: 1. **ATS-11**: Series identifier (pushPIN™ Heat Sink). 2. **F**: Fin pitch/type (Fine pitch). 3. **24**: Height (25mm height). 4. **C2**: Material and Thermal Interface (Aluminum / T766 TIM). 5. **R0**: RoHS compliance status. --- ### 4. Application Use-Cases * **PCB Components:** Ideal for BGA (Ball Grid Array) components measuring roughly 40mm x 40mm. * **Embedded Systems:** Used in industrial PCs where vibration resistance (provided by the springs) is necessary. * **Networking Hardware:** Cooling high-speed controllers in routers and switches.