The **ATS-11F-28-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" attachment series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **Fin Type** | XCUT (Straight Fin with Cross-Cuts) | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 6.57°C/W (@ 1.0 m/s airflow) | | **Thermal Interface (TIM)** | T766 (High performance) | --- ### 2. Key Design Components #### A. XCUT Fin Pattern The heat sink features a **straight-fin** design that has been modified with **cross-cuts**. - **Purpose:** This design creates a large surface area for heat dissipation while allowing for multi-directional airflow. - **Benefit:** It is more effective than standard straight fins in environments where the direction of the fan's airflow might shift or be turbulent. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this part uses a **spring-loaded push-pin** system. - **Composition:** The pins are usually made of brass or plastic with a stainless steel spring. - **Advantage:** Provides consistent pressure (clamping force) across the component, ensuring the thermal interface material (TIM) makes perfect contact. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **ATS-T766**. - This is a high-thermal conductivity phase-change material or grease that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: 1. **ASICs & FPGAs:** High-speed processing units in networking equipment. 2. **Video Processors:** In professional imaging or broadcasting hardware. 3. **Power Modules:** Voltage regulators that generate significant heat in a small footprint. --- ### 4. Thermal Performance Data Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.57 | | 400 | 2.0 | 3.20 | | 600 | 3.0 | 2.40 |