The **ATS-11F-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **blueICE™** series and is designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-11F-30-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.31°C/W (@ 200 LFM) | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System Unlike standard adhesive-backed heat sinks, this part uses the **pushPIN™** system. This involves: * **Compression Springs:** Provide a precise amount of force to ensure optimal contact with the electronic chip. * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes, preventing the part from shifting during vibration or mechanical shock. #### B. Thermal Interface Material (TIM) The part typically comes with a pre-applied **Phase Change Material (T766)**. This material fills the microscopic air gaps between the chip surface and the heat sink base to maximize heat transfer efficiency. #### C. Fin Geometry * **High-Density Fins:** Designed for "forced air" environments (where a fan is present). * **Straight Fin Design:** Allows for low pressure drop and high surface area exposure to airflow. --- ### 3. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed routers and switches. 2. **Industrial Controls:** Managing heat in embedded computing modules. 3. **Data Centers:** High-performance server cooling where space and airflow optimization are critical. ---