The **ATS-11F-31-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11F-31-C2-R0 | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin (Extruded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Design Features This part is engineered for specific thermal management needs: * **Push-Pin Attachment:** The part utilizes a spring-loaded push-pin mechanism. This ensures a consistent pressure on the processor/component, improving thermal interface material (TIM) performance. * **Fin Geometry:** It features a "straight fin" design, which is optimized for **unidirectional airflow**. It is most effective when the fan or air current is aligned with the channels between the fins. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change thermal interface material designed to fill microscopic gaps between the heat sink and the chip. * **Material Choice:** Made of Aluminum 6063, it offers a balance between lightweight construction and high thermal conductivity. --- ### 3. Applications The ATS-11F-31-C2-R0 is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling for small routers, switches, and network interface cards. 2. **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. 3. **Power Supplies:** Heat management for voltage regulators and MOSFETs. 4. **Consumer Electronics:** High-speed processing units in compact enclosures. --- ### 4. Mounting Requirements To install this component, the PCB must have pre-drilled holes. For the "11F" series: * **Hole Pattern:** Standardized to fit specific chip footprints. * **Spring Type:** Usually features a stainless steel spring to maintain 1.5kg - 2.0kg of pressure.