The **ATS-11F-40-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance push-pin heat sink category, specifically designed for thermal management of semiconductors and integrated circuits (ICs). --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Dimensions** | 40mm x 40mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | Approx. 1.25°C/W (at 200 LFM) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System The "11F" in the part number indicates the specific attachment mechanism. This system allows for: * **Easy Installation:** Pre-drilled holes in the PCB allow the spring-loaded pins to snap into place. * **Constant Pressure:** Ensures optimal contact between the heat sink and the electronic component (CPU, FPGA, or GPU). * **Flexibility:** Multiple spring and pin materials are available to match different board thicknesses. ### B. Thermal Interface Material (TIM) The **"R0"** suffix typically indicates that the part comes pre-applied with a high-performance **Phase Change Material (PCM)** or thermal tape. This eliminates the need for manual application of thermal grease during assembly, ensuring a consistent and thin layer for maximum heat transfer. ### C. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides a layer of protection against corrosion and minor electrical insulation, while also increasing emissivity for better radiation cooling. --- ## 3. Application Use-Cases This specific heat sink is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Industrial PC (IPC):** Thermal management for processors in ruggedized environments. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. 4. **Embedded Systems:** Protecting microcontrollers that operate under high load. --- ## 4. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **11** | Series Number (pushPIN™) | | **F** | Fin Pitch / Configuration | | **40** | Length/Width (40mm) | | **C3** | Height code (Specific to 25mm height) | | **R0** | Thermal Interface Material / RoHS Compliance |