The **ATS-11F-45-C3-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink designed by **Advanced Thermal Solutions (ATS)**, specifically part of their "maxiFLOW™" series. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11F-45-C3-R0 | | **Heat Sink Type** | Push-Pin Mount (maxiFLOW™) | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 3.82°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T766 (Pre-applied Thermal Interface Material) | --- ### ### Key Electronic Components & Design Features #### 1. maxiFLOW™ Fin Geometry The "maxiFLOW" design uses a tapered fin structure. This geometry is engineered to maximize surface area for heat dissipation while minimizing the pressure drop. This is critical in crowded electronic enclosures where airflow might be restricted. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or bulky brackets, this part uses a **plastic push-pin** system with a compression spring. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic component (CPU, GPU, or ASIC). * **Benefit:** Allows for easy installation and removal without damaging the PCB. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip. * **Advantage:** Eliminates the need for manual thermal paste application, ensuring a uniform and high-conductivity thermal path. #### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Black Anodized Finish:** This is not just for aesthetics; an anodized surface increases **thermal emissivity**, allowing the part to radiate heat more effectively into the surrounding environment. --- ### ### Applications This part is typically used to cool high-heat generating components on a Printed Circuit Board (PCB), such as: * **Processors (CPUs/DSPs)** * **FPGA/ASIC chips** * **Power Supplies** * **Network Switches**