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  • ATS-11F-72-C3-R0

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    The **ATS-11F-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount / Push-Pin | | **Dimensions** | 45mm x 45mm x 15mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.60 °C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T412 (Phase Change Material) | --- ### 2. Physical Design Features * **Fin Pattern:** This model typically utilizes a **Fine Pitch** or **Cross-Cut** pattern. This maximizes surface area for heat dissipation while allowing airflow from multiple directions. * **Attachment Mechanism:** The "72" in the part number refers to the specific attachment style—in this case, **Push Pins**. These pins use a compression spring to ensure even pressure across the surface of the chip. * **Material Choice:** Made of **Aluminum 6063**, which offers a balance between thermal conductivity, weight reduction, and corrosion resistance. --- ### 3. Electronic Application & Performance This part is used in electronics where active cooling (fans) or passive cooling (ambient air) is required to prevent thermal throttling or component failure. #### Thermal Performance Chart The efficiency of the ATS-11F-72-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.60 | | 300 (1.5 m/s) | 5.20 | | 500 (2.5 m/s) | 3.60 | --- ### 4. Part Number Breakdown (Suffixes) * **C3:** Refers to the specific thermal interface material or a variation in the spring tension/pin material. * **R0:** Indicates that the product is RoHS (Restriction of Hazardous Substances) compliant, meaning it is free from lead and other toxic materials.
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the push-pin mechanism on this heat sink?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used for power transistors or is it strictly for BGA/FPGA chips?