The **ATS-11F-85-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink designed for high-density cooling applications. Below is a detailed breakdown of its specifications and design features. ### 1. General Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-11F-85-C3-R0 | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Category** | Heat Sinks | | **Heat Sink Type** | push-PIN™ | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 24.11 °C/W (Unducted Flow) | --- ### 2. Physical Dimensions This heat sink is designed for compact electronic packages where space is limited but heat dissipation is critical. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 10.00 mm * **Fin Pitch:** Fine Pitch * **Material:** Aluminum (AL6063) * **Finish:** Blue Anodized --- ### 3. Key Electronic Cooling Technologies #### A. Fine-Pitch Design The "85" in the part number indicates a specific fin density. This high-density fin arrangement increases the total surface area, allowing for efficient heat transfer from the electronic component (CPU, FPGA, or MOSFET) to the surrounding air. #### B. push-PIN™ Attachment Instead of using messy thermal adhesives or tapes, this part uses a mechanical push-pin system. * **Reliability:** Provides consistent pressure on the component. * **Pre-assembled:** Usually comes with a pre-drilled hole pattern and brass pins with stainless steel springs. #### C. Thermal Interface Material (TIM) The **C3** designation indicates that the unit typically comes with **ATS-PPS-11** thermal interface material. This ensures that microscopic air gaps between the chip and the heat sink are filled, maximizing thermal conductivity. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (m/s) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 1.0 | 200 | 12.60 | | 2.0 | 400 | 7.90 | | 3.0 | 600 | 6.30 | --- ### 5. Application Use-Cases * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and power supplies.