The **ATS-11F-86-C3-R0** is a specific electronic component primarily categorized as a **High-Performance Heat Sink**. It is part of the Advanced Thermal Solutions (ATS) "maxiFLOW™" series, designed for cooling electronic integrated circuits (ICs) and surface-mount devices (SMDs). ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11F-86-C3-R0 | | **Heat Sink Type** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Thermal Resistance** | 6.04 °C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Spread Fin (Optimized for airflow) | --- ### 2. Key Electronic & Mechanical Design Features #### A. The pushPIN™ Attachment System Unlike traditional adhesive-based heat sinks, the "R0" designation indicates it uses a **pushPIN™** system. This consists of: * **Spring-loaded Pins:** Provides precise pressure (pre-assembled) to ensure optimal thermal interface contact. * **Ease of Rework:** Allows for the heat sink to be removed and re-attached without damaging the PCB or the chip. #### B. Thermal Performance (maxiFLOW™ Design) The "F" in the part number refers to the **maxiFLOW™** geometry. * **Spread Fin Pattern:** The fins are angled outwards. This reduces pressure drop and increases the surface area exposed to moving air, making it more efficient than standard square-cut heat sinks. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal pad or phase-change material (often T766) to ensure low thermal resistance between the component and the sink. #### C. Component Compatibility This part is specifically engineered for: * **BGA (Ball Grid Array) Packages:** Common in high-speed CPUs, FPGAs, and GPUs. * **Limited Height Enclosures:** With a height of only 10mm, it is suitable for low-profile 1U server racks or compact industrial computers. --- ### 3. Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial controllers and IoT gateways. * **Power Electronics:** Dissipating heat from high-speed power converters.