The **ATS-11F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (straight fin) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body The unit is made from **extruded aluminum**. Aluminum is chosen for its high thermal conductivity and lightweight properties. The "Fine Pitch" design provides a high surface-area-to-volume ratio, which is critical for dissipating heat into the surrounding air via convection. #### B. Attachment System (Push-Pins) Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system: * **Spring-loaded mechanism:** Ensures constant pressure between the heat sink and the chip. * **Reliability:** Mechanical mounting is more durable than thermal tape, especially in high-vibration environments or systems that experience extreme temperature cycling. #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component. * **Performance:** T412 is a high-efficiency phase-change or foil-based material that ensures maximum heat transfer. --- ### 3. Thermal Performance (Air Flow) The efficiency of the ATS-11F-87-C3-R0 depends heavily on the velocity of air (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** ~6.80 °C/W * **High Airflow (600 LFM):** ~2.50 °C/W * **Interpretation:** The lower the °C/W (degrees Celsius per Watt), the more efficient the heat sink is at keeping the component cool. --- ### 4. Part Number Breakdown Understanding the suffix codes: * **ATS-11F:** The family and fin configuration. * **87:** Specific dimensions/design iteration. * **C3:** Denotes the material and finish (typically refers to the thermal performance grade). * **R0:** Indicates the revision and specific packaging/mounting hardware (Push-pin type).