The **ATS-11F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling of surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Type** | Heat Sink (BGA/Chipset Cooling) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 33.02° C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | maxiFLOW (High Performance) | | **Pitch** | Fine Pitch | --- ### 2. Key Component Features #### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread fin structure. Unlike standard straight-fin heat sinks, this design reduces pressure drop and increases the surface area exposed to airflow, which is critical for densely packed electronic enclosures. #### B. pushPIN™ Attachment The part uses the proprietary **pushPIN™** system, which includes: * **Brass Component:** A durable attachment pin. * **Compression Spring:** Ensures consistent interface pressure between the heat sink and the electronic chip to maximize heat transfer. * **Ease of Assembly:** Requires pre-drilled holes in the PCB for secure mounting. #### C. Phase Change Material (TIM) The suffix often indicates the Thermal Interface Material (TIM). This specific model usually comes with **T412** or similar pre-applied thermal tape or grease, ensuring there are no air gaps between the component and the sink. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed switching silicon. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Managing heat for voltage regulators or power modules. --- ### 4. Part Number Breakdown (Example) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **11:** Series identifier * **F:** Fin height/Style code * **91:** Size/Specific footprint identifier * **C3:** Material/Finish code (Blue Anodized) * **R0:** Revision or Packaging code