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  • ATS-11H-75-C3-R0

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    The **ATS-11H-75-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in constrained spaces. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | High-end thermal engineering | | **Part Series** | pushPIN™ | Spring-loaded attachment system | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Fin Type** | Straight Fin | Optimized for linear airflow | | **Thermal Resistance** | 1.97 °C/W (at 100 LFM) | Rate of heat transfer efficiency | | **Finish** | Blue Anodized | Protects against corrosion; aesthetics | | **Dimensions** | 45mm x 45mm x 10mm | Large surface area, low profile | --- ## 2. Key Electronic Components ### A. The Heatsink (Passive Element) The primary role of the aluminum body is to increase the surface area of the heat-generating electronic component. The **Straight Fin** design is ideal for systems with a dedicated fan providing unidirectional airflow. ### B. Thermal Interface Material (TIM) * **Part Included:** T412 * **Function:** This is a pre-applied phase-change material or thermal tape. It fills the microscopic air gaps between the chip and the heatsink to ensure maximum heat transfer. ### C. Mechanical Attachment (Push-Pin) Unlike adhesive-only solutions, the **C3-R0** variant uses a mechanical attachment system: * **Brass Push-Pins:** Durable pins that lock into the PCB. * **Stainless Steel Springs:** Provide consistent downward pressure (compression) to maintain contact even under vibration. --- ## 3. Performance Metrics The effectiveness of this part depends on the **Air Velocity** (measured in LFM - Linear Feet per Minute). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.97 | | 200 (1.0 m/s) | 1.45 | | 400 (2.0 m/s) | 1.10 | | 600 (3.0 m/s) | 0.95 | --- ## 4. Part Number Breakdown ```text ATS - 11 H - 75 - C3 - R0 | | | | | | | | | | | Revision | | | | Thermal Interface Material (T412) | | | Heatsink Height (10mm) | | Series (Straight Fin) | Heat Sink Number Advanced Thermal Solutions ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish beyond aesthetics?
    • ⤷ Can this heatsink be used on a PCB without pre-drilled holes?
    • ⤷ How does the 'C3' thermal interface material compare to high-performance thermal paste?