ATS-11H-75-C3-R0
AI

The **ATS-11H-75-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in constrained spaces.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification | Description |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) | High-end thermal engineering |
| **Part Series** | pushPIN™ | Spring-loaded attachment system |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Fin Type** | Straight Fin | Optimized for linear airflow |
| **Thermal Resistance** | 1.97 °C/W (at 100 LFM) | Rate of heat transfer efficiency |
| **Finish** | Blue Anodized | Protects against corrosion; aesthetics |
| **Dimensions** | 45mm x 45mm x 10mm | Large surface area, low profile |
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## 2. Key Electronic Components
### A. The Heatsink (Passive Element)
The primary role of the aluminum body is to increase the surface area of the heat-generating electronic component. The **Straight Fin** design is ideal for systems with a dedicated fan providing unidirectional airflow.
### B. Thermal Interface Material (TIM)
* **Part Included:** T412
* **Function:** This is a pre-applied phase-change material or thermal tape. It fills the microscopic air gaps between the chip and the heatsink to ensure maximum heat transfer.
### C. Mechanical Attachment (Push-Pin)
Unlike adhesive-only solutions, the **C3-R0** variant uses a mechanical attachment system:
* **Brass Push-Pins:** Durable pins that lock into the PCB.
* **Stainless Steel Springs:** Provide consistent downward pressure (compression) to maintain contact even under vibration.
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## 3. Performance Metrics
The effectiveness of this part depends on the **Air Velocity** (measured in LFM - Linear Feet per Minute).
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 1.97 |
| 200 (1.0 m/s) | 1.45 |
| 400 (2.0 m/s) | 1.10 |
| 600 (3.0 m/s) | 0.95 |
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## 4. Part Number Breakdown
```text
ATS - 11 H - 75 - C3 - R0
| | | | | |
| | | | | Revision
| | | | Thermal Interface Material (T412)
| | | Heatsink Height (10mm)
| | Series (Straight Fin)
| Heat Sink Number
Advanced Thermal Solutions
```
- ⤷
What is the significance of the 'Blue Anodized' finish beyond aesthetics?
- ⤷ Can this heatsink be used on a PCB without pre-drilled holes?
- ⤷ How does the 'C3' thermal interface material compare to high-performance thermal paste?