ATS-11H-76-C2-R0
AI

The **ATS-11H-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
Below are the primary mechanical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 15mm |
| **Fin Style** | Straight Fin |
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### 2. Design and Construction
The design of the ATS-11H-76-C2-R0 focuses on efficient airflow and secure mounting:
* **Push-Pin Attachment:** It uses a brass push-pin mechanism with a high-performance compression spring. This ensures a consistent and repeatable pressure (clamping force) on the electronic component for optimal thermal transfer.
* **Fin Configuration:** It features a "Straight Fin" design. This is optimized for systems where there is a clear, directional path for airflow (ducted or open air).
* **Blue Anodized Coating:** The aluminum is treated with a blue anodized finish, which not only provides corrosion resistance but also slightly increases surface emissivity for better radiation cooling.
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### 3. Electronic Application Use-Cases
This heat sink is typically found in space-constrained electronic assemblies:
* **Integrated Circuits (ICs):** Cooling high-speed logic gates or microcontrollers.
* **Power Management:** Regulating temperature for small VRMs (Voltage Regulator Modules).
* **Embedded Systems:** Ideal for 25mm footprint chips in industrial or networking equipment.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 11.57 |
| 200 (1.0 m/s) | 5.65 |
| 300 (1.5 m/s) | 4.43 |
| 500 (2.5 m/s) | 3.39 |
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- ⤷What type of thermal interface material (TIM) is recommended for use with this heat sink?
- ⤷ How do I calculate the correct hole diameter on a PCB for the push-pin mounting?
- ⤷ Is there a cross-reference for this part in a copper material instead of aluminum?