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  • ATS-11H-76-C2-R0

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    The **ATS-11H-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | --- ### 2. Design and Construction The design of the ATS-11H-76-C2-R0 focuses on efficient airflow and secure mounting: * **Push-Pin Attachment:** It uses a brass push-pin mechanism with a high-performance compression spring. This ensures a consistent and repeatable pressure (clamping force) on the electronic component for optimal thermal transfer. * **Fin Configuration:** It features a "Straight Fin" design. This is optimized for systems where there is a clear, directional path for airflow (ducted or open air). * **Blue Anodized Coating:** The aluminum is treated with a blue anodized finish, which not only provides corrosion resistance but also slightly increases surface emissivity for better radiation cooling. --- ### 3. Electronic Application Use-Cases This heat sink is typically found in space-constrained electronic assemblies: * **Integrated Circuits (ICs):** Cooling high-speed logic gates or microcontrollers. * **Power Management:** Regulating temperature for small VRMs (Voltage Regulator Modules). * **Embedded Systems:** Ideal for 25mm footprint chips in industrial or networking equipment. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.57 | | 200 (1.0 m/s) | 5.65 | | 300 (1.5 m/s) | 4.43 | | 500 (2.5 m/s) | 3.39 | ---
    ✨ Follow-up Questions
    • ⤷What type of thermal interface material (TIM) is recommended for use with this heat sink?
    • ⤷ How do I calculate the correct hole diameter on a PCB for the push-pin mounting?
    • ⤷ Is there a cross-reference for this part in a copper material instead of aluminum?