ATS-12B-10-C2-R0
AI

The **ATS-12B-10-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Value / Description |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material** | T766 (Pre-applied phase change material) |
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### 2. Physical Design Elements
#### **A. Fin Profile**
The unit features a **straight fin** design. Straight fins are optimized for unidirectional airflow. This allows air to pass through the channels with minimal resistance, making it highly effective in systems with dedicated cooling fans.
#### **B. Attachment Mechanism (Push-Pin)**
The "12B" and "R0" designations often correlate to the specific mounting hardware.
* **Push-Pins:** These provide a secure, vibration-resistant connection to the PCB.
* **Springs:** Compressed springs ensure consistent "Downward Pressure," which is critical for maintaining contact between the heat sink base and the chip.
#### **C. Thermal Interface Material (TIM)**
The part comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance.
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### 3. Thermal Performance
The efficiency of this part is measured by its **Thermal Resistance** (°C/W), which varies based on airflow velocity (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | ~7.89 |
| 300 (1.5 m/s) | ~2.13 |
| 500 (2.5 m/s) | ~1.47 |
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **12:** Series/Design identifier.
* **B:** Specific mounting/attachment variation.
* **10:** Length/Width sizing code.
* **C2:** Blue Anodized finish (improves radiation heat transfer and corrosion resistance).
* **R0:** Revision or packaging code.
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What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to unfinished aluminum?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?