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  • ATS-12B-10-C2-R0

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    The **ATS-12B-10-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Physical Design Elements #### **A. Fin Profile** The unit features a **straight fin** design. Straight fins are optimized for unidirectional airflow. This allows air to pass through the channels with minimal resistance, making it highly effective in systems with dedicated cooling fans. #### **B. Attachment Mechanism (Push-Pin)** The "12B" and "R0" designations often correlate to the specific mounting hardware. * **Push-Pins:** These provide a secure, vibration-resistant connection to the PCB. * **Springs:** Compressed springs ensure consistent "Downward Pressure," which is critical for maintaining contact between the heat sink base and the chip. #### **C. Thermal Interface Material (TIM)** The part comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance. --- ### 3. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance** (°C/W), which varies based on airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~7.89 | | 300 (1.5 m/s) | ~2.13 | | 500 (2.5 m/s) | ~1.47 | --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer). * **12:** Series/Design identifier. * **B:** Specific mounting/attachment variation. * **10:** Length/Width sizing code. * **C2:** Blue Anodized finish (improves radiation heat transfer and corrosion resistance). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to unfinished aluminum?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?