The **ATS-12B-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | maxiFLOW™ (High Performance) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Brass pins with Plastic springs) | | **Thermal Resistance** | 1.37°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 15.00mm | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Breakdown of the Part Number Electronic engineers use the suffix codes to identify specific configurations: * **ATS-12B**: Refers to the series and the basic heat sink profile. * **13**: Refers to the specific fin pattern or size configuration in the catalog. * **C2**: Indicates the color/finish and material (typically Blue Anodized). * **R0**: Indicates the revision level or specific packaging standard. --- ### 3. Key Electronic Components Features #### A. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses a mechanical **pushPIN™** system. This ensures consistent pressure on the processor or component, which is critical for maximizing thermal transfer efficiency. #### B. maxiFLOW™ Fin Design The fins are designed with a graduated pattern. This reduces air pressure drop and increases the surface area exposed to the airflow, making it ideal for systems with high-density PCB layouts where airflow may be restricted. #### C. Thermal Interface Material (TIM) The **T766** material pre-applied to the base is a high-performance thermal pad. When the electronic part heats up, the material changes phase to fill microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. --- ### 4. Typical Applications This component is generally used to cool high-heat-generating electronic integrated circuits (ICs), such as: * **ASICs and FPGAs** in networking hardware. * **CPUs/GPUs** in industrial computing. * **Power Converters** in telecommunications. ---