The **ATS-12B-142-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for securing heat sinks directly to Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight Fin | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Thermal Resistance** | 10.07°C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature that describes its features: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **12B**: Refers to the specific series/attachment style (Push-pin type). * **142**: Dimensional code for the length, width, and fin configuration. * **C2**: Material/Finish code (typically Blue Anodized Aluminum). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Components Included The assembly is not just a block of metal; it consists of several engineered components: #### A. The Heat Sink Body Made of lightweight aluminum, it features a "Straight Fin" design. This is optimized for **undirectional airflow**, meaning air should blow parallel to the fins for maximum cooling efficiency. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses brass push-pins with springs. * **Springs:** Provide a consistent "compression force" to ensure the heat sink remains in tight contact with the chip. * **Brass Pins:** Insert into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a phase-change material that fills the microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or ASIC) to facilitate better heat transfer. --- ### 4. Application and Use Case This part is typically used to cool: * **BGA (Ball Grid Array) Components:** High-speed processors or FPGAs. * **Power Modules:** Converters that generate significant heat in small footprints. * **Telecommunications Gear:** Where reliability and easy maintenance (via push-pins) are required.