The **ATS-12B-155-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-12B-155-C2-R0 | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions & Thermal Performance This component is engineered for precise airflow management to prevent thermal throttling in electronic systems. * **Size (L x W x H):** 40mm x 40mm x 20mm * **Fin Style:** XC-Cut (Cross-cut) * **Thermal Resistance:** * **@ 100 LFM (0.5 m/s):** 5.37 °C/W * **@ 700 LFM (3.5 m/s):** 1.50 °C/W --- ### 3. Key Electronic Design Features #### A. pushPIN™ Attachment Unlike adhesive-based heat sinks, the "12B" series uses a **pushPIN™** system. This provides a constant, uniform pressure across the electronic component (CPU, GPU, or FPGA), ensuring optimal thermal interface material (TIM) performance and preventing the heat sink from shifting due to vibration. #### B. Blue Anodized Coating The blue anodized finish is not just aesthetic. Anodization increases the surface emissivity, allowing for better heat radiation, and provides a non-conductive protective layer that prevents electrical shorts if the heat sink accidentally touches nearby components. #### C. XC-Cut Fin Design The cross-cut fin geometry is designed for **multi-directional airflow**. This is critical in dense electronic enclosures where airflow may not be strictly linear, allowing the part to dissipate heat effectively regardless of the fan's orientation. --- ### 4. Typical Applications This specific heat sink is commonly found in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling VRMs (Voltage Regulator Modules) and MOSFETs. ---