The **ATS-12B-23-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Specialized in thermal management. | | **Material** | Aluminum | Blue Anodized finish for durability and aesthetics. | | **Thermal Resistance** | 12.00°C/W (Unducted) | Performance at 200 LFM (Linear Feet per Minute). | | **Mounting Type** | pushPIN™ | Uses a spring-loaded pin for secure attachment. | | **Dimensions** | 60.00mm x 40.00mm | The "Footprint" of the heatsink. | | **Height** | 9.50mm | Low-profile design for compact enclosures. | | **Attachment** | Brass Component | Includes a stainless steel spring and brass hardware. | --- ### 2. Design Characteristics The ATS-12B-23-C2-R0 utilizes a specialized design to maximize heat dissipation in constrained spaces: * **maxiFLOW™ Fin Structure:** This heatsink uses a "flared" fin design. The fins spread outwards, which increases the surface area and creates more turbulence in the airflow, leading to better cooling efficiency compared to standard straight-fin heatsinks. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes. It ensures a consistent pressure (Force) between the heatsink and the electronic component, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal phase-change material or grease, ensuring immediate "out-of-the-box" installation. --- ### 3. Common Applications This part is generally used in industrial and high-reliability electronics where heat management is critical: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For use in fanless or forced-air industrial PCs. 3. **Power Electronics:** Dissipating heat from voltage regulators and power modules. --- ### 4. Part Number Breakdown ```text ATS - 12 B - 23 - C2 - R0 | | | | | | | | | | | Revision/Finish (Blue Anodized) | | | | Thermal Interface Material (T766) | | | Height Code (9.5mm) | | Series/Fin Style (maxiFLOW) | Thermal Resistance Class Brand (Advanced Thermal Solutions) ```