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  • ATS-12B-40-C2-R0

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    The **ATS-12B-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in constrained airflows. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Base Dimensions** | 57.90mm x 61.00mm | | **Height** | 17.90mm | | **Thermal Resistance** | 1.45°C/W (@ 200 LFM) | | **Attachment Method** | pushPIN™ (Brass pins) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Tape) | --- ## 2. Key Component Features ### A. maxiFLOW™ Fin Design Unlike standard square-cut fins, this heat sink uses a tapered fin structure. This design increases the surface area and encourages turbulent airflow, which significantly reduces the thermal resistance between the component and the ambient air. ### B. pushPIN™ Attachment The "R0" suffix refers to the specific attachment system. This model uses a **pushPIN™** mechanism: * **Ease of Assembly:** It uses a flexible, spring-loaded pin that snaps into pre-drilled holes in the PCB. * **Uniform Pressure:** The compression springs ensure constant pressure on the processor or component, optimizing the thermal interface performance. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal tape**. This eliminates the need for manual application of thermal grease, ensuring a clean, repeatable, and efficient thermal bond between the heat sink and the electronic chip. --- ## 3. Application Use Cases This part is typically used for cooling high-heat density electronic components such as: * **ASICs and FPGAs:** Used in networking and data processing. * **Processors (CPUs/GPUs):** Embedded systems requiring low-profile cooling. * **Power Supplies:** Cooling high-wattage power transistors and modules. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific advantages of the maxiFLOW fin design over traditional straight fins?
    • ⤷ Can this heat sink be used with different attachment methods if the PCB lacks pre-drilled holes?
    • ⤷ How does the thermal resistance value change at different airflow speeds (LFM)?