ATS-12B-40-C2-R0
AI

The **ATS-12B-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in constrained airflows.
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## 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is the breakdown:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Base Dimensions** | 57.90mm x 61.00mm |
| **Height** | 17.90mm |
| **Thermal Resistance** | 1.45°C/W (@ 200 LFM) |
| **Attachment Method** | pushPIN™ (Brass pins) |
| **Spring Type** | Compression Spring |
| **Interface Material** | T766 (Thermal Tape) |
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## 2. Key Component Features
### A. maxiFLOW™ Fin Design
Unlike standard square-cut fins, this heat sink uses a tapered fin structure. This design increases the surface area and encourages turbulent airflow, which significantly reduces the thermal resistance between the component and the ambient air.
### B. pushPIN™ Attachment
The "R0" suffix refers to the specific attachment system. This model uses a **pushPIN™** mechanism:
* **Ease of Assembly:** It uses a flexible, spring-loaded pin that snaps into pre-drilled holes in the PCB.
* **Uniform Pressure:** The compression springs ensure constant pressure on the processor or component, optimizing the thermal interface performance.
### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766 thermal tape**. This eliminates the need for manual application of thermal grease, ensuring a clean, repeatable, and efficient thermal bond between the heat sink and the electronic chip.
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## 3. Application Use Cases
This part is typically used for cooling high-heat density electronic components such as:
* **ASICs and FPGAs:** Used in networking and data processing.
* **Processors (CPUs/GPUs):** Embedded systems requiring low-profile cooling.
* **Power Supplies:** Cooling high-wattage power transistors and modules.
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- ⤷
What are the specific advantages of the maxiFLOW fin design over traditional straight fins?
- ⤷ Can this heat sink be used with different attachment methods if the PCB lacks pre-drilled holes?
- ⤷ How does the thermal resistance value change at different airflow speeds (LFM)?