The part number **ATS-12B-76-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with spring) | | **Thermal Resistance** | 11.57°C/W (at 100 LFM) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS-12B**: Identifies the base series and pin geometry. * **76**: Specific height and fin configuration code. * **C2**: Indicates the material/finish (Aluminum / Blue Anodized). * **R0**: Refers to the revision and packaging status. --- ### 3. Key Electronic Functions While a heat sink is a passive component, its role in an electronic system is critical for: 1. **Heat Dissipation:** It increases the surface area of a heat-generating component (like an IC) to transfer heat more efficiently into the surrounding air. 2. **Thermal Management:** By reducing the junction temperature of a semiconductor, it prevents **thermal throttling** and extends the lifespan of the device. 3. **Mechanical Stability:** The "Push Pin" system ensures constant pressure against the chip, maintaining a stable thermal connection even under mechanical vibration. --- ### 4. Component Comparison (Airflow Performance) The effectiveness of this heat sink depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.57 | | 300 | 1.5 | 4.42 | | 500 | 2.5 | 3.17 | | 700 | 3.5 | 2.61 |