The **ATS-12B-84-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-12B-84-C2-R0 | | **Heat Sink Type** | Push Pin (Spring Loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Attachment Method** | Push Pins (Plastic/Brass) | | **Thermal Resistance** | 9.00°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions** | 30mm x 30mm x 25mm | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ## 2. Key Components & Materials ### A. The Heat Sink Body * **Material:** Made from extruded aluminum. Aluminum is preferred for its high thermal conductivity and lightweight properties. * **Finish:** The "Blue Anodized" finish is not just aesthetic; it increases surface emissivity and provides corrosion resistance. ### B. The Mounting Mechanism (Push Pins) * **Hardware:** This model uses a push pin and spring assembly. The springs ensure even pressure across the component surface, which is critical for maximizing heat transfer to the sink. * **Ease of Use:** This allows for a secure, tool-less installation into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) * **Pre-Applied:** The "R0" suffix usually indicates that a high-performance Thermal Interface Material (T766) is pre-applied to the base of the heat sink. * **Purpose:** The TIM fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ## 3. Performance Analysis The efficiency of the **ATS-12B-84-C2-R0** is highly dependent on airflow (convection). ### Thermal Resistance vs. Airflow | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.00 | | 200 | 1.0 | 5.02 | | 300 | 1.5 | 3.99 | | 400 | 2.0 | 3.46 | *As airflow increases, the thermal resistance drops, allowing the part to dissipate heat more effectively.* --- ## 4. Typical Applications This part is commonly used in electronic systems where space is limited but thermal loads are high: * **Networking Equipment:** Routers, switches, and modems. * **Industrial PCs:** Embedded systems and PLCs. * **Consumer Electronics:** High-end audio/video processors.