The part number **ATS-12B-85-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed specifically for cooling electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | 24.0°C/W (Natural Convection) | | **Airflow Path** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number can be decoded to understand the specific configuration: * **ATS**: Prefix for Advanced Thermal Solutions. * **12B**: Refers to the specific product family and material type. * **85**: Indicates the specific dimensions/footprint (35mm x 35mm). * **C2**: Indicates the color and finish (Blue Anodized). * **R0**: Refers to the revision or packaging standard. --- ### 3. Key Electronic Cooling Features #### High-Performance Fin Design The heat sink uses a **Straight Fin** profile. This is optimized for environments where there is a consistent direction of airflow, providing a high surface-area-to-volume ratio to dissipate heat from the semiconductor package into the ambient air. #### superGRIP™ Attachment One of the most critical aspects of this part is the mounting mechanism. It uses a custom-molded clip that: * Does not require holes in the PCB. * Applies steady pressure to the component, improving thermal contact. * Can be easily removed and reattached without damaging the motherboard. #### Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material or high-performance pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 4. Typical Applications This component is commonly found in: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Base stations and signal processing units.