The **ATS-12B-87-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 2.72°C/W @ 200 LFM | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 12.70mm | | **Fin Style** | Spread Fin (Tapered) | --- ### 2. Core Design Components #### A. Thermal Performance (C2 Rating) The "C2" in the part number indicates the **Thermal Interface Material (TIM)** provided. This specific model comes pre-applied with **T766 phase-change material**, which ensures low contact resistance between the electronic component (CPU/GPU/FPGA) and the heat sink. #### B. pushPIN™ Attachment System Instead of simple adhesive tape, this unit uses a **pushPIN™** system. This consists of: * **Brass/Plastic Pins:** For securing the sink to the PCB. * **Compression Springs:** These provide a precise amount of pressure (load) on the component to ensure optimal heat transfer. * **Hole Pattern:** Designed for specific PCB hole layouts (standard pitch). #### C. Fin Geometry The **maxiFLOW™** design features a "flared" or spread fin geometry. This increases the surface area significantly compared to standard square-cut heat sinks, allowing for better cooling even at lower air velocities (measured in Linear Feet per Minute or LFM). --- ### 3. Applications This part is typically used to cool small-to-medium electronic components that generate significant heat in compact spaces: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Voltage regulators and high-speed memory modules. ---