The **ATS-12D-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of high-heat electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Pitch (Fin Density)** | Fine Pitch (Rectangular Pattern) | | **Thermal Resistance** | 26.32 °C/W (at 100 LFM) | | **Weight** | ~0.027 kg (27 grams) | --- ### 2. Design and Engineering Features * **Heat Sink Material:** Constructed from high-quality Aluminum 6063, which offers a balance between high thermal conductivity and structural integrity. * **Push-Pin Attachment:** This model uses a tool-free push-pin mechanism. The "12D" designation refers to the specific hole spacing and spring tension designed to ensure consistent pressure across the interface material. * **Fin Geometry:** The part features a rectangular "Straight Fin" design. This is optimized for uni-directional airflow, providing a low pressure drop and efficient heat dissipation in systems with forced convection (fans). * **Thermal Interface Material (TIM):** It typically comes with a pre-applied Phase Change Material (PCM) or thermal tape to ensure a low-resistance thermal path between the chip and the heat sink. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **12D** | Attachment series and hole pattern | | **03** | Dimensional height code (15mm) | | **C2** | Performance class (Aluminum/Standard) | | **R0** | Revision code/RoHS Compliance status | --- ### 4. Typical Applications * **Computing:** Northbridge/Southbridge cooling on motherboards. * **Embedded Systems:** Industrial PCs and routers. * **Power Electronics:** Voltage regulators and LED drivers where space is limited but thermal loads are high.