The **ATS-12D-05-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 26.91 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (H)** | 25.00 mm | | **Pitch (Mounting Hole)** | 33.00 mm | | **Finish** | Blue Anodized | | **TIM (Interface Material)** | T766 (High Performance) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Fin Pattern:** It utilizes a **Fine Pitch** or **Straight Fin** design which optimizes airflow for high-density electronic assemblies. * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. #### B. The pushPIN™ Attachment System * **Spring-Loaded Mechanism:** The "push-pin" allows for easy installation and provides consistent pressure on the heat source to maximize heat transfer. * **Secure Fit:** It eliminates the need for messy adhesives or permanent glues, making the component serviceable. #### C. Thermal Interface Material (TIM) * **Pre-Applied T766:** This unit comes with a pre-applied thermal pad (T766). This ensures that the microscopic air gaps between the component (e.g., a chip) and the heat sink are filled, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** For cooling small processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where vertical space is constrained to 25mm. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators that generate localized heat. --- ### 4. Thermal Performance Data Thermal resistance varies based on the airflow (velocity) provided by system fans: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :---: | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 26.91 | 12.67 | 7.37 | 5.39 | 4.41 | ---