The **ATS-12D-10-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin)** | 25mm | | **Pitch** | Fine Pitch | | **Fin Pattern** | XCUT (Cross-cut) | | **Thermal Resistance** | ~7.89°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **12D**: Refers to the specific series and mounting hole configuration. * **10**: Indicates the specific dimensions/profile in the series. * **C2**: Refers to the thermal interface material (TIM) or specific finish/performance grade. * **R0**: Indicates the revision or specific packaging standard. --- ### 3. Key Features * **XCUT Fin Design:** The fins are cut in a cross pattern. This allows for multi-directional airflow, making it ideal for systems where air may come from different angles or is turbulent. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this uses a precise spring-loaded pin mechanism. This ensures constant pressure on the chip for optimal heat transfer. * **Pre-assembled:** Most parts in this series come with the spring and pin pre-attached, reducing assembly time on the production line. * **High-Performance TIM:** Usually comes with pre-applied Thermal Interface Material (like T766) to ensure high conductivity between the heat source and the aluminum. --- ### 4. Common Applications This heat sink is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For industrial computers where airflow might be restricted. * **Power Supplies:** Managing heat in voltage regulators or MOSFETs. * **Telecom Equipment:** Used on PCBs where high reliability and vibration resistance (provided by the push-pins) are required.