The **ATS-12D-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **blueICE™** or **pushPIN™** family, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-12D-153-C2-R0 | | **Thermal Resistance** | 4.05°C/W (at 100 LFM) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Attachment Type** | pushPIN™ (Spring Loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body * **Design:** This model typically utilizes a **Fine Pitch** or **Cross-Cut** fin pattern. This increases the surface area available for heat dissipation while maintaining low pressure drop for air flowing through the system. * **Material:** Made from **Aluminum 6063**, which offers a balance between high thermal conductivity and structural rigidity. * **Anodization:** The "Blue Anodized" finish is not just for aesthetics; it provides a protective layer against corrosion and slightly increases emissivity for better radiant heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complicated screws, this part uses the ATS pushPIN™ system: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB (Printed Circuit Board) through pre-drilled holes. * **Stainless Steel Springs:** Provide "Precise Compression Force," ensuring that the heat sink stays in firm contact with the component without cracking the silicon die. #### C. Thermal Interface Material (TIM) The suffix **C2** indicates that the part comes with **T766 thermal grease** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Performance:** T766 is a high-performance phase-change or grease material that optimizes the heat transfer path. --- ### 3. Applications This specific size (40mm x 40mm) is commonly used for: * **Northbridge/Southbridge** chips on motherboards. * **FPGAs and ASICs** in networking equipment. * **Industrial Power Supplies** where passive or forced-air cooling is required. ---