The **ATS-12D-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below is the breakdown of its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin Mount) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight (High-flow design) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | Approx. 4.74°C/W @ 200 LFM (Airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Material:** Made of aluminum for optimal weight-to-thermal conductivity ratio. * **Anodization:** The "C2" in the part number indicates a **Blue Anodized** finish, which provides corrosion resistance and slightly improves radiative heat transfer. * **Fin Geometry:** It features a "Super-Grip" or high-performance fin array designed to maximize surface area while maintaining low pressure drop for cooling fans. #### B. The Attachment Mechanism (Push-Pin) * Unlike adhesive tapes, this model uses **Push-Pins** with integrated springs. * **Reliability:** This provides a consistent, high-pressure contact between the heat sink and the chip, ensuring the thermal interface material (TIM) performs efficiently. * **Mechanical Security:** It protects the component from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) * The part comes with **T766** pre-applied to the base. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases This specific part is generally used in environments where active airflow (fans) is present: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PC boards and controllers. 3. **Power Electronics:** Dissipating heat from high-speed data processing chipsets. ---