The **ATS-12D-17-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for electronic cooling applications. --- ### 1. Technical Specifications This part is a thermal management solution designed to dissipate heat from integrated circuits (ICs) and other electronic components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 15.44°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific logic used by ATS to identify the physical and thermal characteristics of the unit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **12**: Series identifier. * **D**: Material/Fin configuration code. * **17**: Specific model dimension/designator. * **C2**: Material and Thermal Interface Material (Aluminum, T766). * **R0**: Revision or packaging code. --- ### 3. Electronic Application & Function In an electronic system, this part serves the following roles: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or GPU), allowing the surrounding air to carry heat away more efficiently. * **Mechanical Attachment:** The "Push Pin" mechanism uses a brass or plastic pin with a compressed spring. This ensures a consistent **mounting pressure** against the chip, which is critical for maximizing heat transfer through the Thermal Interface Material (TIM). * **Compatibility:** The 54mm x 54mm footprint is common for large-format processors or power modules. --- ### 4. Thermal Performance Thermal resistance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.44 | | 300 (1.5 m/s) | 4.38 | | 500 (2.5 m/s) | 2.58 | ---