The **ATS-12D-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family, designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-199 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 50mm x 50mm | | **Height (Fin Height)** | 20mm | | **Thermal Resistance** | 1.58°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **12**: Denotes the specific family of attachment (Push-pin type). * **D**: Refers to the spring material/type (typically indicates a specific tension level). * **199**: The unique identifier for the specific fin geometry and footprint (50x50x20mm). * **C2**: Color/Finish code (Blue Anodized). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Features & Components #### A. Fin Design This heat sink features **Cross-Cut fins**. Unlike straight fins, cross-cut designs allow for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. Push-Pin Attachment Mechanism The "12D" series uses a spring-loaded push-pin system. * **Benefits:** It provides consistent pressure (load) on the processor, ensuring maximum contact with the thermal interface material. * **Installation:** Requires pre-drilled holes in the PCB. The brass pins have a "harpoon" tip that locks into the PCB. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal grease and ensures a low-resistance thermal path between the chip and the aluminum base. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.50 | | 200 | 1.0 | 1.58 | | 400 | 2.0 | 1.15 | | 600 | 3.0 | 0.98 |