The **ATS-12D-20-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing thermal solutions to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 7.14°C/W @ (Natural Convection) | | **Airflow Pattern** | Straight Fin | --- ### 2. Key Components & Construction The part is engineered to dissipate heat from integrated circuits (ICs) and other surface-mount components through several design choices: * **Heat Sink Material:** Extruded aluminum is used for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** The blue finish is not just aesthetic; it protects the aluminum from corrosion and increases emissivity for better radiant heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance phase-change material that ensures minimal thermal resistance between the component and the heat sink. * **Push-Pin Attachment:** It utilizes a brass push-pin with a stainless steel spring. This provides consistent pressure (load) on the chip, which is critical for maximizing the efficiency of the thermal interface. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.43 | | 400 (2.0 m/s) | 2.91 | | 600 (3.0 m/s) | 2.23 | | 800 (4.0 m/s) | 1.81 | --- ### 4. Application Use Cases The **ATS-12D-20-C2-R0** is commonly found in the following electronic environments: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards and controllers. * **Power Supplies:** Regulating heat in MOSFETs or Power ICs. * **Processors:** Cooling CPUs or FPGAs that operate within a 45mm footprint.