The **ATS-12D-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number itself encodes specific mechanical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass pins with plastic caps) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.31°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 57.0mm x 57.0mm x 25.0mm | | **Fin Style** | Tapered Fin (Cross-cut) | --- ### 2. Design Characteristics This component is engineered for optimized airflow and secure mechanical mounting: * **Tapered Fin Design:** The "maxiFLOW" geometry features a flared fin structure that increases the surface area while reducing pressure drop, making it more efficient in forced-air environments. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this model uses a precision-engineered push-pin system. This ensures consistent pressure across the thermal interface material (TIM) for better heat transfer. * **Material and Coating:** It is made from extruded aluminum for lightweight thermal conductivity and finished with a **blue anodized** coating to prevent corrosion and increase emissivity. --- ### 3. Application Use Cases The ATS-12D-30-C2-R0 is typically used in environments where electronic components generate significant heat in a confined space: 1. **Telecommunications:** Cooling line cards or high-speed networking switches. 2. **Industrial PCs:** Maintaining safe operating temperatures for processors in rugged enclosures. 3. **Power Electronics:** Dissipating heat from high-wattage voltage regulators or power modules. --- ### 4. Thermal Performance Table *Performance varies based on airflow speed (Measured in Linear Feet per Minute - LFM):* | Airflow Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 5.31 | 3.39 | 2.50 | 2.11 |