ATS-12D-39-C2-R0
AI

The **ATS-12D-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in environments with limited airflow.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is the breakdown:
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 12.70mm |
| **Thermal Resistance** | 1.89°C/W (at 200 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Design Features
* **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered base and a high-aspect-ratio spread. This reduces pressure drop and increases the surface area for heat dissipation, making it ideal for high-density PCB layouts.
* **pushPIN™ Attachment:** This model uses a spring-loaded push-pin mechanism. This ensures:
1. **Uniform Pressure:** Maintains consistent contact between the heat sink and the electronic component (like a BGA or CPU).
2. **Ease of Assembly:** Quick installation without the need for specialized tools.
* **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink.
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### 3. Applications
This part is typically used to cool high-heat-generating electronic components in the following industries:
* **Telecommunications:** Network switches, routers, and base stations.
* **Computing:** High-speed servers and embedded systems.
* **Industrial:** Power supplies and motor controllers.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 1.89 |
| 400 (2.0 m/s) | 1.23 |
| 600 (3.0 m/s) | 1.02 |
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How does the pushPIN attachment system compare to adhesive tapes?
- ⤷ What are the advantages of black anodized aluminum in thermal management?
- ⤷ Can this heat sink be customized for different height constraints?