Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-12D-39-C2-R0

  • AI
    The **ATS-12D-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in environments with limited airflow. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 12.70mm | | **Thermal Resistance** | 1.89°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered base and a high-aspect-ratio spread. This reduces pressure drop and increases the surface area for heat dissipation, making it ideal for high-density PCB layouts. * **pushPIN™ Attachment:** This model uses a spring-loaded push-pin mechanism. This ensures: 1. **Uniform Pressure:** Maintains consistent contact between the heat sink and the electronic component (like a BGA or CPU). 2. **Ease of Assembly:** Quick installation without the need for specialized tools. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Applications This part is typically used to cool high-heat-generating electronic components in the following industries: * **Telecommunications:** Network switches, routers, and base stations. * **Computing:** High-speed servers and embedded systems. * **Industrial:** Power supplies and motor controllers. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.89 | | 400 (2.0 m/s) | 1.23 | | 600 (3.0 m/s) | 1.02 |
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN attachment system compare to adhesive tapes?
    • ⤷ What are the advantages of black anodized aluminum in thermal management?
    • ⤷ Can this heat sink be customized for different height constraints?