ATS-12D-50-C2-R0
AI

The **ATS-12D-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs).
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### 1. Technical Specifications
The part number provides specific data regarding its physical and thermal properties:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height** | 15.00 mm |
| **Pitch** | Fine Pitch (Cross-Cut) |
| **Thermal Resistance** | 18.99 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Component Breakdown
The assembly consists of several key electronic hardware elements:
* **Heat Sink Body:** A cross-cut fin design which increases surface area. This allows for multi-directional airflow, making it ideal for crowded PCB environments where air direction may vary.
* **Push-Pins:** These are plastic or brass pins that lock into pre-drilled holes on the PCB. They ensure constant pressure for maximum heat transfer.
* **Compression Springs:** Built into the push-pins to provide a specific "sink-to-chip" force, preventing the heat sink from shifting during vibration or shipping.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied—a high-performance phase-change material that fills microscopic air gaps between the component (CPU/GPU) and the heat sink.
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### 3. Usage & Applications
This part is commonly used in the following electronic sectors:
1. **Telecommunications:** For cooling small processors in routers and switches.
2. **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm.
3. **Power Electronics:** Managing heat for MOSFETs or high-speed voltage regulators.
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### 4. Thermal Performance Data
*Measured in °C/W (Degrees Celsius per Watt):*
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow** | 18.99 | 7.10 | 4.10 | 2.90 | 2.30 |
| **Ducted Flow** | 3.00 | 1.90 | 1.60 | 1.40 | 1.30 |
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What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the 'Blue Anodized' finish affect thermal radiation?
- ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM)?