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  • ATS-12D-50-C2-R0

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    The **ATS-12D-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ### 1. Technical Specifications The part number provides specific data regarding its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 15.00 mm | | **Pitch** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 18.99 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Component Breakdown The assembly consists of several key electronic hardware elements: * **Heat Sink Body:** A cross-cut fin design which increases surface area. This allows for multi-directional airflow, making it ideal for crowded PCB environments where air direction may vary. * **Push-Pins:** These are plastic or brass pins that lock into pre-drilled holes on the PCB. They ensure constant pressure for maximum heat transfer. * **Compression Springs:** Built into the push-pins to provide a specific "sink-to-chip" force, preventing the heat sink from shifting during vibration or shipping. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied—a high-performance phase-change material that fills microscopic air gaps between the component (CPU/GPU) and the heat sink. --- ### 3. Usage & Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** For cooling small processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm. 3. **Power Electronics:** Managing heat for MOSFETs or high-speed voltage regulators. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 18.99 | 7.10 | 4.10 | 2.90 | 2.30 | | **Ducted Flow** | 3.00 | 1.90 | 1.60 | 1.40 | 1.30 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does the 'Blue Anodized' finish affect thermal radiation?
    • ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM)?