ATS-12D-64-C2-R0
AI

The **ATS-12D-64-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the **blueICE™** series and is designed for high-density electronic cooling.
---
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 9.39°C/W (at 100 LFM) |
| **Airflow Direction** | Vertical (Cross-Cut) |
| **Pressure Drop** | 0.15 in. H2O (at 200 LFM) |
---
### 2. Design and Engineering Features
### A. Fin Geometry
The heat sink features a **Cross-Cut fin design**. Unlike straight-fin heat sinks, the cross-cut pattern increases surface area and creates turbulence in the airflow, which significantly enhances the heat dissipation rate (Convection Efficiency).
### B. pushPIN™ Attachment System
One of the most critical aspects of this part is the **pushPIN™ system**.
- **Mechanical Advantage:** It uses a compression spring and a plastic pin to ensure a precise, repeatable pressure against the component (CPU, GPU, or FPGA).
- **Interface Stability:** The constant pressure optimizes the performance of the Thermal Interface Material (TIM).
### C. Material and Coating
- **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
- **Blue Anodization:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer.
---
### 3. Application Use Cases
This part is typically found in the following electronic environments:
* **Telecommunications:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Cooling MOSFETs or power regulators.
* **Edge Computing:** Cooling processors in confined spaces where forced air is available.
---
### 4. Thermal Performance Data
Performance varies based on the Airflow (Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 9.39 |
| 200 | 5.21 |
| 300 | 4.07 |
| 400 | 3.48 |
- ⤷
How does the pushPIN™ attachment compare to traditional adhesive thermal tape?
- ⤷ What is the importance of the LFM rating when selecting this heat sink?
- ⤷ Are there alternative finishes to blue anodized for higher temperature environments?