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  • ATS-12D-67-C2-R0

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    The part number **ATS-12D-67-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series designed for thermal management of electronic components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.39 °C/W (Unducted Flow @ 100 LFM) | | **Pressure Pattern** | 38mm x 38mm (Pitch) | | **Spring/Pin Type** | ATS-PP-04 / ATS-HKH-01 | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: * **ATS**: Prefix for Advanced Thermal Solutions. * **12**: Refers to the series or specific tooling family. * **D**: Likely indicates the attachment style or internal iteration code. * **67**: Specific size and fin configuration identifier. * **C2**: Indicates the material/finish (Aluminum with Blue Anodized finish). * **R0**: RoHS compliance and revision status. --- ### 3. Key Features * **pushPIN™ Attachment:** This system allows for a secure, high-tension connection to the PCB using a spring-loaded pin mechanism. It ensures consistent pressure across the interface for optimal heat transfer. * **Low Profile:** At only 10mm in height, this heat sink is designed for tight spaces where vertical clearance is limited (e.g., 1U servers or mobile workstations). * **Thermal Performance:** Designed specifically for forced air environments. The fin geometry is optimized to reduce pressure drop while maximizing surface area contact with air. --- ### 4. Implementation Requirements To use this part effectively in an electronic design, you typically require: 1. **Thermal Interface Material (TIM):** A pad or paste (like T766) must be applied between the chip and the heat sink. 2. **PCB Hole Pattern:** The board must have pre-drilled holes at a **38mm x 38mm** spacing to accommodate the pushPINs. 3. **Airflow Direction:** Performance is highly dependent on the "LFM" (Linear Feet per Minute) of the fan cooling the system.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods to pushPIN for this heat sink?
    • ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Is there a version of this heat sink with a higher vertical profile for better cooling?