ATS-12D-67-C2-R0
AI

The part number **ATS-12D-67-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series designed for thermal management of electronic components like CPUs, GPUs, and FPGAs.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 20.39 °C/W (Unducted Flow @ 100 LFM) |
| **Pressure Pattern** | 38mm x 38mm (Pitch) |
| **Spring/Pin Type** | ATS-PP-04 / ATS-HKH-01 |
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### 2. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific configuration:
* **ATS**: Prefix for Advanced Thermal Solutions.
* **12**: Refers to the series or specific tooling family.
* **D**: Likely indicates the attachment style or internal iteration code.
* **67**: Specific size and fin configuration identifier.
* **C2**: Indicates the material/finish (Aluminum with Blue Anodized finish).
* **R0**: RoHS compliance and revision status.
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### 3. Key Features
* **pushPIN™ Attachment:** This system allows for a secure, high-tension connection to the PCB using a spring-loaded pin mechanism. It ensures consistent pressure across the interface for optimal heat transfer.
* **Low Profile:** At only 10mm in height, this heat sink is designed for tight spaces where vertical clearance is limited (e.g., 1U servers or mobile workstations).
* **Thermal Performance:** Designed specifically for forced air environments. The fin geometry is optimized to reduce pressure drop while maximizing surface area contact with air.
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### 4. Implementation Requirements
To use this part effectively in an electronic design, you typically require:
1. **Thermal Interface Material (TIM):** A pad or paste (like T766) must be applied between the chip and the heat sink.
2. **PCB Hole Pattern:** The board must have pre-drilled holes at a **38mm x 38mm** spacing to accommodate the pushPINs.
3. **Airflow Direction:** Performance is highly dependent on the "LFM" (Linear Feet per Minute) of the fan cooling the system.
- ⤷
What are the alternative attachment methods to pushPIN for this heat sink?
- ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
- ⤷ 400 LFM)?
- ⤷ Is there a version of this heat sink with a higher vertical profile for better cooling?