The **ATS-12D-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The model name contains specific information regarding its dimensions and performance parameters. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Heat Sinks | | **Fin Type** | Straight / Square | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.10°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout planning and ensuring no interference with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Pitch (Hole spacing)** | 38.00 mm | | **Weight** | ~50-60 grams (Typical for size) | --- ### 3. Key Electronic Cooling Components The assembly consists of three primary functional parts: 1. **The Heat Sink Body:** Constructed from Aluminum 6063. The straight-fin design allows for multi-directional airflow, making it versatile for different chassis orientations. 2. **The Interface Material (TIM):** This specific model typically comes with **T412** thermal interface material pre-applied to the base. This fills microscopic air gaps between the component and the heat sink to maximize heat transfer. 3. **The pushPIN™ Attachment:** * **Springs:** Provides consistent pressure to ensure optimal contact with the electronic chip. * **Pins:** Made of durable brass or plastic, designed to lock into standard 3.0mm PCB holes. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): * **@100 LFM (0.5 m/s):** 5.10 °C/W * **@200 LFM (1.0 m/s):** 2.50 °C/W * **@300 LFM (1.5 m/s):** 1.80 °C/W ---