ATS-12D-75-C1-R0
AI

The **ATS-12D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here is the breakdown of its technical parameters:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin (with Springs) |
| **Thermal Resistance (Flow)** | 14.95°C/W (at 100 LFM) |
| **Thermal Resistance (Static)** | 4.95°C/W (at 500 LFM) |
| **Material** | Aluminum (AL6063) |
| **Fin Style** | Straight Fin |
| **Dimensions** | 45mm x 45mm x 10mm |
| **Surface Treatment** | Blue Anodized |
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### 2. Design Features
* **pushPIN™ Attachment:** This model uses a plastic push-pin and a compression spring. This provides a precise and reliable attachment to the Printed Circuit Board (PCB) without needing adhesive tapes or complex brackets.
* **Thermal Interface Material (TIM):** It typically comes pre-applied with high-efficiency thermal grease (usually ATS-54) to ensure maximum heat transfer between the component and the heat sink.
* **Low Profile:** With a height of only **10mm**, it is ideal for space-constrained applications like 1U servers, laptops, or compact networking devices.
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### 3. Thermal Performance Comparison
The effectiveness of this heat sink varies depending on the airflow (Linear Feet per Minute - LFM) within the device:
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **°C/W (Unducted)** | 14.95 | 5.61 | 3.22 | 2.33 | 1.88 |
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### 4. Integration Considerations
When incorporating this part into a PCB design, keep the following in mind:
* **Hole Pattern:** You must drill holes in the PCB to accommodate the push-pins. The standard hole size for this series is usually **3.175mm**.
* **Keep-out Zone:** Ensure there are no SMDs (Surface Mount Devices) directly under the push-pin clips to avoid mechanical interference or shorts.
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- ⤷
What is the exact hole pattern spacing required for this heat sink?
- ⤷ Can the ATS-12D-75-C1-R0 be used with a custom thermal pad instead of the pre-applied grease?
- ⤷ How does 'Blue Anodized' finishing affect the thermal performance?