ATS-12D-82-C2-R0
AI

The **ATS-12D-82-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices (SMDs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height** | 25.00mm |
| **Fin Style** | Straight (Square) |
| **Thermal Resistance** | 2.49°C/W (at 200 LFM) |
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### 2. Key Components & Design
The "pushPIN™" system is what defines the electronic integration of this part:
* **The Heat Sink Body:** Uses a high-surface-area fin design to facilitate convection. The blue anodized coating protects against corrosion and improves radiative heat transfer.
* **pushPIN™ Attachment:** Instead of messy adhesives, it uses plastic or brass pins and springs. This ensures even pressure (preload) across the component, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM).
* **Compression Springs:** These provide the necessary force to keep the heat sink in contact with the chip during mechanical shocks or vibrations.
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### 3. Nomenclature Breakdown
Part numbers for ATS heat sinks follow a specific logic:
* **ATS-12D:** Refers to the series (typically pushPIN™ high-performance).
* **82:** Designates the specific fin geometry and footprint.
* **C2:** Indicates the material and finish (Aluminum/Blue Anodized).
* **R0:** Revision code or packaging indicator.
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### 4. Thermal Performance Context
Thermal resistance is the most important metric for an electronic engineer selecting this part. As airflow (measured in Linear Feet per Minute - LFM) increases, the resistance decreases:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 4.30 |
| 200 (1.0 m/s) | 2.49 |
| 500 (2.5 m/s) | 1.58 |
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- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How do I calculate if 2.49°C/W is sufficient for my specific processor?