The **ATS-12D-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-PPS-12 | | **Thermal Resistance** | 7.00°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine-Pitch (Straight) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance from surrounding components. * **Length (A):** 30.00 mm * **Width (B):** 30.00 mm * **Height (C):** 25.00 mm * **Pitch (E):** 35.00 mm (Distance between mounting holes) * **Pitch (F):** 35.00 mm --- ### 3. Key Features and Mechanical Design #### A. Attachment System (pushPIN™) This part utilizes a standardized push-pin mechanism. This allows for: * **Uniform Pressure:** The pre-assembled springs ensure consistent pressure across the interface material, improving thermal transfer. * **Ease of Assembly:** Quick installation into pre-drilled PCB holes without the need for complex mounting hardware. #### B. Thermal Interface Material (TIM) The suffix **C2** typically indicates that the heat sink comes with a pre-applied high-performance thermal interface material (T-726), which eliminates the need for manual thermal paste application. #### C. Fin Design The **Straight Fin** design is optimized for environments with consistent airflow. The fine-pitch fins maximize surface area while maintaining a low profile, making it suitable for compact electronic enclosures. --- ### 4. Typical Applications * **Microprocessors (CPUs) and GPUs:** Small-form-factor cooling. * **FPGAs & ASICs:** Cooling high-speed logic devices in networking equipment. * **Power Supplies:** Heat dissipation for voltage regulators and power transistors. * **Industrial Electronics:** Ensuring stability in high-ambient temperature environments.