The **ATS-12D-86-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Spring Type** | ATS-PPS-12 | --- ### 2. Key Components & Features #### A. Fin Design (Cross-Cut) The "86" in the part number corresponds to a specific fin pattern. This model typically features a **cross-cut** or straight fin design that allows for multi-directional airflow, making it versatile for different system layouts. #### B. pushPIN™ Attachment System This part utilizes the ATS pushPIN™ system, which includes: * **Spring-loaded mechanism:** Ensures precise pressure (Pre-assembled) to maximize thermal interface material (TIM) performance. * **Flexible Mounting:** Designed to fit specific hole patterns on a PCB (Printed Circuit Board). #### C. Material and Coating * **Aluminum 6063:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Increases surface emissivity (improving radiation heat transfer) and provides corrosion resistance. --- ### 3. Thermal Performance (Estimated) Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.50 | | 300 (1.5 m/s) | 1.30 | | 500 (2.5 m/s) | 1.00 | --- ### 4. Application Use Cases * **Telecommunications:** Cooling of high-speed data transceivers. * **Embedded Systems:** Heat management for industrial PC processors. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators. ---